DEVICE AND METHOD FOR SUBSTRATE PROCESSING

摘要

Device for processing a substrate in a processing plant, comprises at least one process tool (3) exhibiting two oppositely arranged substrate planes, that are oriented at least approximately perpendicular, and arranged in at least one processing area (2). The device is adapted for processing at least two substrates simultaneously in the processing area with the process tool. The substrates are arranged in the substrate planes such that the coatings of the substrates face each other and a quasi-closed process space is formed between the substrates at least during the processing. An independent claim is also included for processing coated substrates in a processing plant comprising at least two substrates in the processing area arranged in the oppositely arranged substrate planes, where the substrate exhibits coatings.