METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: A method for manufacturing a semiconductor substrate is provided to prevent the warpage of a substrate by using a laser. CONSTITUTION: A substrate is prepared in a reactor(S311). The substrate has a convex surface. A semiconductor substrate is grown in the convex surface by using mixed gas(S312). Laser is irradiated on the semiconductor substrate to separate the substrate from a semiconductor substrate(S313). [Reference numerals] (AA) Start; (BB) End; (S311) Installing a substrate in a reactor; (S312) Growing a semiconductor substrate on a convex surface of the substrate; (S313) Separating the substrate and the semiconductor substrate by irradiating laser; (S314) Washing the surface of the separated semiconductor substrate