LAPPING DEVICE FOR SEMICONDUCTOR SUBSTRATE AND LAPPING METHOD USING IT

摘要

PURPOSE: A lapping device for a semiconductor substrate and a lapping method using the same are provided to improve process speed by using a double side lapping method. CONSTITUTION: A lapping device for a semiconductor substrate includes an upper plate(100) for lapping an upper surface of a substrate; and a lower plate(200) for lapping a lower surface of the substrate. A carrier(300) is positioned between the upper plate and the lower plate. The carrier includes a mounting hole. A supporting part(400) is adhered to the upper and the lower surface.