发明名称 SELF-ALIGNED INSULATED FILM FOR HIGH-K METAL GATE DEVICE
摘要 A method of making an integrated circuit includes providing a semiconductor substrate and forming a gate dielectric over the substrate, such as a high-k dielectric. A metal gate structure is formed over the semiconductor substrate and the gate dielectric and a thin dielectric film is formed over that. The thin dielectric film includes oxynitride combined with metal from the metal gate. The method further includes providing an interlayer dielectric (ILD) on either side of the metal gate structure.
申请公布号 US2013056837(A1) 申请公布日期 2013.03.07
申请号 US201113244365 申请日期 2011.09.24
申请人 NG JIN-AUN;CHANG MAXI;YANG JEN-SHENG;LIN TA-WEI;LO SHIH-HAO;YEH CHIH-YANG;LIN HUI-WEN;KAO JUNG-HUI;TU YUAN-TIEN;LIN HUAN-JUST;PENG CHIH-TANG;JENG PEI-REN;YOUNG BAO-RU;CHUANG HAK-LAY;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 NG JIN-AUN;CHANG MAXI;YANG JEN-SHENG;LIN TA-WEI;LO SHIH-HAO;YEH CHIH-YANG;LIN HUI-WEN;KAO JUNG-HUI;TU YUAN-TIEN;LIN HUAN-JUST;PENG CHIH-TANG;JENG PEI-REN;YOUNG BAO-RU;CHUANG HAK-LAY
分类号 H01L29/772;H01L21/28;H01L21/336 主分类号 H01L29/772
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