发明名称 MONITORING DEVICE, MONITORING SYSTEM AND MONITORING METHOD
摘要 <p>A monitoring device: measures a three dimensional shape in the surroundings of the monitoring device; estimates the self-position of the monitoring device by collating the measured three-dimensional shape with a self-position estimation map including the shape and position of structural objects inside a building excluding facility elements; extracts the facility elements in the periphery of the estimated self-position from a facility element collation map that includes the shape and position of facility elements inside the building; extracts the shape and position of a facility element candidate from the measured three-dimensional shape; calculates the degree of conformity between the shape and position of the facility element in the periphery of the self-position extracted from the facility element collation map and the shape and position of the facility element candidate extracted from the measured three-dimensional shape, on the basis of the error distribution of the shape and position of the facility element in the periphery of the self-position and the error distribution of the shape and position of the facility element candidate extracted from the measured three-dimensional shape; and identifies which of the facility elements in the surroundings of the self-position extracted from the facility element collation map is the shape of the facility element candidate extracted from the measured three-dimensional object on the basis of the calculated degree of conformity.</p>
申请公布号 WO2013030929(A1) 申请公布日期 2013.03.07
申请号 WO2011JP69462 申请日期 2011.08.29
申请人 HITACHI, LTD.;KOGA, MASASHI 发明人 KOGA, MASASHI
分类号 G01B11/00;G21C17/00 主分类号 G01B11/00
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