LASER PROCESSING DEVICE

摘要

PURPOSE: A laser processing device is provided to cool a wafer by spraying gas when laser-cutting the wafer. CONSTITUTION: A laser processing device(100) comprises a laser generator(110), a laser output unit(120), and a gas spraying unit. The laser generator generates laser. The laser output unit exposes the laser in order to cut a workpiece. The gas spraying unit sprays gas on the spot where the laser output unit exposes the laser to the workpiece. The gas spraying unit comprises a nozzle for spraying the gas and a gas supply unit(132) which is connected to the nozzle in order to supply the gas. The position of the laser output unit and gas spraying unit are adjustable. A control unit(140) controls the position of the gas spraying unit and the laser output unit. The nozzle controls spraying angle and distance. The nozzle is combined in the laser output unit. The nozzle has the spraying angle of 0-90°from the surface of the workpiece.