发明名称 MANUFACTURING DEVICES AND METHOD OF PRINTED CIRCUIT BOARD
摘要 PURPOSE: A device for manufacturing a printed circuit board is provided to prevent the warpage of the printed circuit board by using magnetic force. CONSTITUTION: A carrier substrate(200) is made of a magnetic material. An electromagnet line(100) attracts the carrier substrate and transfers. The electromagnet line is coated with a chemical resistance material. A circuit layer(300) is formed on the carrier substrate. The carrier substrate is adhered to both sides of the electromagnet line. The carrier substrate includes nickel, cobalt, and iron.
申请公布号 KR20130022928(A) 申请公布日期 2013.03.07
申请号 KR20110085969 申请日期 2011.08.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 AHN, SEOK HWAN;LEE, YONG SAM
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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