发明名称 |
MANUFACTURING DEVICES AND METHOD OF PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE: A device for manufacturing a printed circuit board is provided to prevent the warpage of the printed circuit board by using magnetic force. CONSTITUTION: A carrier substrate(200) is made of a magnetic material. An electromagnet line(100) attracts the carrier substrate and transfers. The electromagnet line is coated with a chemical resistance material. A circuit layer(300) is formed on the carrier substrate. The carrier substrate is adhered to both sides of the electromagnet line. The carrier substrate includes nickel, cobalt, and iron.
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申请公布号 |
KR20130022928(A) |
申请公布日期 |
2013.03.07 |
申请号 |
KR20110085969 |
申请日期 |
2011.08.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
AHN, SEOK HWAN;LEE, YONG SAM |
分类号 |
H05K3/46;H05K1/02 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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