PHOTOSENSITIVE RESIN COMPOSITION

摘要

PURPOSE: A photosensitive resin composition is provided to be used as a liquid phase and to modify a cured film. CONSTITUTION: A photosensitive resin composition contains 10-70 wt% of resin, 0.1-20 wt% of a photopolymerization initiator, 1-20 wt% of unsaturated ethylene-based monomer, 5-20 wt% of a thermosetting agent, and 1-40 wt% of a phosphate compound. The resin is UV-curable and is developed in an alkaline solution.