| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor module that provides a good electrical and mechanical stability and has a long service life, even in the presence of electrical arcing. <P>SOLUTION: A first press pin 6 having a foot 8 is provided. A base 12 of the foot 8 is provided for contacting with contact elements 4a, 4b of a power semiconductor device 3. This contact elements are arranged on a base plate 2. Insulation means 13 is provided for electrically insulating an outer surface 14 of the foot 8. A power semiconductor module 1 is also provided. A power semiconductor module assembly having a plurality of power semiconductor modules 1 is also provided. Here, the power semiconductor modules 1 are arranged side by side to each other with electric connections between adjacent power semiconductor modules 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
