EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME
摘要
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
申请公布号
WO2013032238(A2)
申请公布日期
2013.03.07
申请号
WO2012KR06919
申请日期
2012.08.30
申请人
LG INNOTEK CO., LTD.;KIM, HAE YEON;MOON, SUNG BAE;PARK, JAE MAN;PARK, JEUNG OOK;YOON, JONG HEUM;CHO, IN HEE
发明人
KIM, HAE YEON;MOON, SUNG BAE;PARK, JAE MAN;PARK, JEUNG OOK;YOON, JONG HEUM;CHO, IN HEE