| 摘要 |
<P>PROBLEM TO BE SOLVED: To respond to requirements of improvement and modification in hot melt adhesives for use in dermal applications, in particular hot melt adhesives which leave no residue upon removal from the skin. <P>SOLUTION: A hot melt adhesive composition comprises a high molecular weight rubber and less than about 60 pts.mass of a liquid diluent, and has a G' of less than about 15×10<SP POS="POST">4</SP>dynes/cm<SP POS="POST">2</SP>at 10 rad/s at 25°C. The hot melt adhesive is useful for adhesive skin application (e.g., surgical tape), including transdermal drug delivery applications. <P>COPYRIGHT: (C)2013,JPO&INPIT |
