| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a division device capable of dividing the whole region of a plate-like member into chips by relatively moving holding means of the plate-like member on which a division schedule line was formed and external force application means for dividing the plate-like member. <P>SOLUTION: A division device 10 for dividing a wafer WF along a division schedule line LS comprises: holding means 11 for holding the wafer WF supported via an adhesive sheet AS; external force application means 12 for applying an external force for dividing the wafer WF; and moving means 14 for relatively moving the holding means 11 and the external force application means 12. The division device deforms the wafer WF so as to bend by ejecting a gas to an adhesion sheet AS to apply an external force while moving the external force application means 12 in a horizontal direction along a surface of the wafer WF held in the holding means 11. This divides the wafer WF into chips CI on the division schedule line LS. <P>COPYRIGHT: (C)2013,JPO&INPIT |
