| 摘要 |
On a circuit board of the high-frequency module, an RF circuit and an antenna element are arranged, and transmission lines between both the RF circuit and the antenna element are provided. The transmission line of the RF circuit side among the transmission lines is led-out from the top of the circuit board to a rear surface side of the circuit board through a via hole, and the transmission line of the antenna element side is led-out from the top of the circuit board to the rear surface side through another via hole. Electrical continuity between tip portions of the transmission lines is blocked off on the rear surface of the circuit board; however, when the high-frequency module is mounted on the motherboard, a bridging connection land is soldered to each of the tip portions, so that the transmission lines are connected with each other.
|
