| 摘要 |
According to one embodiment, a semiconductor device includes a base board, a mounting substrate, a semiconductor element, a holder, a holder terminal, a case, a first sealing layer, and a second sealing layer. The mounting substrate is provided on the base board. The semiconductor element is provided on the mounting substrate. The holder is provided above the mounting substrate. The holder terminal is held by the holder and electrically connected to the semiconductor element. The case surrounds the mounting substrate along a side face of the mounting substrate and surrounds the holder along a side face of the holder. The first sealing layer covers the mounting substrate and the semiconductor element inside a space surrounded by the case. The second sealing layer is provided on the first sealing layer inside the space surrounded by the case and has a higher hardness than the first sealing layer.
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