| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate high in connection reliability of an electrode of an electronic component relative to an electrode pad. <P>SOLUTION: The electronic component mounting substrate includes: an insulation substrate 1 comprising a plurality of stacked insulation layers 2 formed of a glass ceramic sintered body; and a through conductor 4 formed from a top surface of the insulation substrate 1 toward an inside thereof. A percentage content of glass at an end 4a on a top surface side of the insulation substrate 1 in the through conductor 4 is adjusted to be lower than that of glass at other portions, and the end of the through conductor 4 is an electrode pad 3 connected to an electrode 12 of an electronic component 11 mounted on the top surface of the insulation substrate 1. Since a percentage content of glass of the electrode pad 3 is low, wettability of the electrode pad 3 against a wax material is improved, so that connection reliability between the electrode pad 3 and the electrode 12 can be increased. <P>COPYRIGHT: (C)2013,JPO&INPIT |
