| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating device capable of obtaining a uniform plating thickness even when using a cup type plating process for plating a square substrate. <P>SOLUTION: The plating device 100 includes a plating tank 110 in which a plating liquid exhaust nozzle 130 is formed on a bottom face, an anode part 150 which is located above the plating liquid exhaust nozzle 130 and has a slit 155 formed therein, and a cathode part 120 which is located above the plating tank 110. <P>COPYRIGHT: (C)2013,JPO&INPIT |
