发明名称 |
SEMICONDUCTOR MODULE AND COOLER |
摘要 |
A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.
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申请公布号 |
US2013058041(A1) |
申请公布日期 |
2013.03.07 |
申请号 |
US201113634813 |
申请日期 |
2011.04.21 |
申请人 |
GOHARA HIROMICHI;ICHIMURA TAKESHI;MOROZUMI AKIRA;FUJI ELECTRIC CO., LTD. |
发明人 |
GOHARA HIROMICHI;ICHIMURA TAKESHI;MOROZUMI AKIRA |
分类号 |
F28F3/12;H05K7/20 |
主分类号 |
F28F3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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