HIGH-FREQUENCY MODULE AND METHOD FOR INSPECTING HIGH-FREQUENCY MODULE

摘要

A high-frequency module is equipped with: a high-frequency circuit chip; a wiring substrate which includes connection pads for connecting input/output terminals of the high-frequency circuit chip; a spiral inductor which is connected between two terminals connected to the connection pads; and a ground potential detection conductor which is provided at a position opposite the spiral inductor. The spiral inductor is provided in either the high-frequency circuit chip or the wiring substrate, the detection conductor is provided in the other, and inductance between the connection pads is measured.