| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrochemical device capable of preventing a part provided with a via conductor part from being broken by stress generated due to thermal expansion and contraction accompanying temperature change in reflow soldering or temperature change after mounting, etc., even when the via conductor part is used for a lead-out conductor. <P>SOLUTION: A first lead-out conductor 50 has a via conductor part 52 along a thickness direction of a plate-like part 22 (upper layer 22a), and the via conductor part 52 is provided off the center of the plate-like part 22. Namely, the via conductor part 52 is provided avoiding the center CT of the plate-like part 22 on which the stress generated owing to the thermal expansion and contraction accompanying the temperature change in the reflow soldering, the temperature change or the like after the mounting, etc., is apt to concentrate, so even if the stress generated owing to the thermal expansion and contraction is applied to the plate-like part 22, a risk of breakage of the part of the plate-like part 22 where the via conductor part 52 is provided, by the stress, can be securely avoided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
