| 摘要 |
Provided are: a curable composition making it possible to obtain a cured article having excellent processing moldability, high heat resistance, and high enough Tg to be usable as a mold resin for an SiC power semiconductor; and a cured article thereof. The curable composition contains: 100 parts by mass of a compound of a molecule that has at least two partial structures represented by general formula (1), as a component (A); 0.5 to 3 parts by mass of a thermal radical generator, as a component (B); and 0 to 50 parts by mass of a different radical reactive compound, as a component (C) (in the formula, A represents a benzene ring or a cyclohexyl ring; R1 represents a C1-6 alkylene group; R2 represents a C1-4 alkyl group; a represents a number 0 or 1; b represents an integer 0 to 3; and c represents a number 1 or 2). |
