Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TS V to at least one of a test input and a test evaluation circuit.
申请公布号
WO2013033628(A1)
申请公布日期
2013.03.07
申请号
WO2012US53516
申请日期
2012.08.31
申请人
RAMBUS INC.;VOGELSANG, THOMAS;NG, WILLIAM;WARE, FREDERICK, A.