| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which improves processes, such as adhesive application, that are drawbacks in the workability during the manufacturing of a multi-chip package having a stacked structure, and enables semiconductor chips to be stacked without using an adhesive, and has excellent reliability in various points. <P>SOLUTION: A resin sealing type semiconductor device of a multi-chip package having a stacked structure has a resin layer of a photosensitive resin composition, including a cyclic olefin resin (A) having an epoxy group and a photoacid generator (B), on a circuit element formation surface of a semiconductor chip. Further, a rear surface of another semiconductor chip stacked on the semiconductor chip directly contacts with the resin layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
