METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device that can be downsized and be easily manufactured, and to provide a method of manufacturing the same.

SOLUTION: A semiconductor device includes: a semiconductor chip 12 mounted on a substrate 10; a first resin sealing portion 30 provided on the substrate 10 so as to seal the semiconductor chip 12; a through metal 32 provided on the substrate 10 so as to penetrate through the first resin sealing portion 30 around the semiconductor chip 12; and an upper metal 34 electrically connected to the through metal 32 and provided on the first resin sealing portion 30 so as to extend from the through metal 32 to the semiconductor chip 12 side along the top surface of the first resin sealing portion 30. The through metal 32 and the upper metal 34 have an integrated structure.

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