| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which enables implementation with high connection reliability without limiting a formation method of solder bumps formed on a semiconductor chip while maintaining a plurality of connection parts by solder bumps comparable with each other in area. <P>SOLUTION: A semiconductor device comprises: a semiconductor chip 1 including an element formation surface on which at least one element is formed and a plurality of electrode pads 2 formed on the element formation surface; a wiring board 10 with a principal surface arranged opposite to the element formation surface of the semiconductor chip 1 and including a plurality of connection pads 15 formed at locations opposite to the electrode pads 2 on the principal surface, respectively; and a plurality of solder bumps 4 each arranged between the electrode pad 2 and the connection pad 15 for electrically connecting the electrode pad 2 and the connection pad 15. Compositions of the solder bump 4 on the electrode pad 2 side and the connection pad 15 side are the same. <P>COPYRIGHT: (C)2013,JPO&INPIT |
