| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a silicon wafer using a polishing composition, allowing reduction of the number of LPD caused by polishing working on a surface of an object to be polished after polishing using the polishing composition. <P>SOLUTION: The manufacturing method of a silicon wafer of the present invention is characterized by comprising a preliminary polishing step using a polishing composition containing at least one kind water-soluble polymer selected from polyvinyl pyrrolidone and poly N-vinyl formamide and a finishing polishing step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
