发明名称 |
METHOD OF AND APPARATUS FOR CMP PAD CONDITIONING |
摘要 |
A chemical mechanical polishing (CMP) apparatus is provided that includes a conditioning disc for conditioning a polishing pad of the CMP apparatus. The conditioning disc includes a plurality of portions of subsystem discs. The portions may be regions of the disc that are concentric. Each portion of the disc is operable to rotate at a different angular velocity. In some embodiments, a different applied loading is provided to each of the portions of the disc in addition to or in lieu of the different angular velocities. |
申请公布号 |
US2013059503(A1) |
申请公布日期 |
2013.03.07 |
申请号 |
US201113227155 |
申请日期 |
2011.09.07 |
申请人 |
YEH HSIU-MING;WU FENG-INN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. ("TSMC") |
发明人 |
YEH HSIU-MING;WU FENG-INN |
分类号 |
B24B1/00;B24B53/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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