摘要 |
This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. |
申请人 |
QUALCOMM MEMS TECHNOLOGIES, INC.;PETERSEN, KURT, EDWARD;SHENOY, RAVINDRA, V.;BLACK, JUSTIN, PHELPS;BURNS, DAVID, WILLIAM;GANAPATHI, SRINIVASAN, KODAGANALLUR;STEPHANOU, PHILIP, JASON;BUCHAN, NICHOLAS, IAN |
发明人 |
PETERSEN, KURT, EDWARD;SHENOY, RAVINDRA, V.;BLACK, JUSTIN, PHELPS;BURNS, DAVID, WILLIAM;GANAPATHI, SRINIVASAN, KODAGANALLUR;STEPHANOU, PHILIP, JASON;BUCHAN, NICHOLAS, IAN |