Improved high density, hard tip arrays for use in patterning including an article comprises a handle chip; and a silicon nitride membrane bonded to at least a portion of the handle chip. The silicon nitride membrane comprises an array of a plurality of silicon nitride tips extending directly from a surface of the silicon nitride membrane. A method comprises preparing a silicon nitride membrane comprising an array of a plurality of silicon nitride tips extending directly from a surface of the silicon nitride membrane; preparing a handle wafer; and bonding the silicon nitride membrane to at least a portion of the handle wafer to form an bonded tip array. Another article comprises an elastomeric backing member; and an array of tips disposed on the elastomeric backing member. The tips of the array comprise a refractory material. Another method comprises providing at least one mold for a tip array comprising a plurality of mold regions for tips; filling or coating the mold regions for tips with a refractory material, to form an array of tips comprising a refractory material; and disposing a liquid elastomer precursor material in contact with the refractory material of the tips.
申请公布号
WO2012158838(A3)
申请公布日期
2013.03.07
申请号
WO2012US38206
申请日期
2012.05.16
申请人
NANOINK, INC.;HENNING, ALBERT K.;SHILE, RAYMOND ROGER;FRAGALA, JOSEPH S.;AMRO, NABIL A.;HAAHEIM, JASON R.
发明人
HENNING, ALBERT K.;SHILE, RAYMOND ROGER;FRAGALA, JOSEPH S.;AMRO, NABIL A.;HAAHEIM, JASON R.