RADIO INTEGRATED CIRCUIT PACKAGE, METHOD FOR MANUFACTURING SAME, AND DEVICE FOR TESTING A RADIO INTEGRATED CIRCUIT

摘要

The present invention relates to a radio integrated circuit package. The radio integrated circuit package according to one embodiment of the present invention comprises: a substrate; a signal line printed on the substrate; a plurality of radio integrated circuits stacked on the substrate; and spacers located between the plurality of radio integrated circuits. The radio integrated circuits comprises: an integrated circuit; a radio communication pad; and a protective layer, wherein the radio communication pad is arranged on the integrated circuit, the protective layer is arranged on the integrated circuit and radio communication pad, and any one of the radio integrated circuits is coupled to the signal by a bonding wire. Accordingly, the intervals between the radio integrated circuits are kept constant while the radio integrated circuits are stacked, so that the performance of the radio integrated circuit package may be enhanced.