LEAD FLAME FOR LED PACKAGE OF HIGH LIGHT EFFICIENCY

摘要

PURPOSE: A lead frame for an LED package with high luminous efficiency is provided to minimize a loss of luminous efficiency by mounting an LED chip after a part of a chip bonding unit is depressed with a downset structure. CONSTITUTION: A lead frame(100) for a first LED package includes a substrate(10), a plurality of chip bonding units(110), and a reflector(120). The chip bonding unit includes a depression(111), a protrusion(112), and a lead(113). The protrusion is surrounded by one or more LED chips mounted in the depression. The protrusion is inclined based on the bottom of the depression. The lead is bidirectionally extended based on the depression. The reflector is formed on the upper side of the chip bonding unit and reflects light emitted from the LED chips.