POLYMER RESIN COMPOSITION, POLYIMIDE RESIN FILM, METHOD FOR PREPARING THE POLYIMIDE RESIN FILM, METAL STACKED STRUCTURE, AND CIRCUIT BOARD

摘要

The present invention relates to a polymer resin composition which can provide an insulating material having superior mechanical properties and a low dielectric constant, to a polyimide resin film obtained using same, to a method for preparing the polyimide resin film, and to a metal stacked structure and circuit board including the polyimide resin film.