WIRING FAULT DETECTION METHOD, WIRING FAULT DETECTION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

摘要

A wiring fault detection method according to one embodiment of the present invention is capable of determining that the corresponding pixel is faulty when the value of temperature increase of a faulty section exceeds the temperature increase threshold value within a frame number threshold value that has been set in advance. This wiring fault detection device is provided with a temperature measurement imaging unit for measuring and imaging the temperature of a semiconductor substrate.