METHOD OF BONDING A SUBSTRATE TO A SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

A method according to embodiments of the invention includes posi¬ tioning a flexible film (48) over a wafer of semiconductor light emit¬ ting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sand¬ wiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).