WHITE LEDS WITH EMISSION WAVELENGTH CORRECTION

摘要

Methods for fabricating semiconductor light-emitting devices such as LED chips with emission wavelength correction and devices fabricated using these methods. Different embodiments include sequential coating methods that provide two or more coatings or layers of conversion material over LEDs, which can be done at the wafer level. The methods are particularly applicable to fabricating LED chips that emit a warm white light, which typically requires covering LEDs with one or more wavelength conversion materials such as phosphors. In one embodiment, a base wavelength conversion material is applied (step 44) to the semiconductor devices. A portion of the base conversion material is removed (step 46). At least two different tuning wavelength conversion materials are also applied to the semiconductor devices, either after (step 48) or before (step 52) the application of the base conversion material.