PHOTORESIST STRIP PROCESSES FOR IMPROVED DEVICE INTEGRITY

摘要

PURPOSE: Photoresist strip processes are provided to efficiently remove a photoresist or relating residue by adopting hydrogen-based strip chemical materials. CONSTITUTION: A substrate with a photoresist is provided(201). A bulk photoresist strip is performed(203). A finish point of the bulk resist strip is detected(205). An overstrip process is performed(207). [Reference numerals] (201) Providing a substrate having photoresist thereon; (203) Performing a bulk photoresist strip; (205) Detecting a finish point; (207) Performing an overstrip process