ELECTRONIC COMPONENT MODULE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component module that enhances reliability by suppressing detachment of an electronic component from a circuit substrate in high temperature environment.

SOLUTION: An electronic component module 1 comprises: a circuit substrate 2 in which first and second metal plates 5 and 7 are bonded to both surfaces of a ceramic substrate 3; an electronic component 9 that is bonded to the first metal plate 5 via a first wax material layer 8 and is operable at least at 125°C; and a base plate 11 bonded to the second metal plate 7 via a second wax material layer 10. The first wax material layer 8 is made of an Ag-Cu system wax material or an Al system wax material having a melting point that is higher than an operating temperature of the electronic component 9 and is in a range of 575 to 730°C. A ratio of a thickness of the first metal plate 5 to a thickness of the second metal plate 7 is in a range of 50 to 200%.

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