发明名称 SUBSTRATE WITH SPRING TERMINAL AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To reinforce a solder connection part of a spring terminal in a substrate with the spring terminal. <P>SOLUTION: A substrate with a spring terminal includes: a substrate 10 including connection pads P; spring terminals 30, each of which has a connection part 32 connected with the connection pad P by a solder layer 22; and reinforcement resin parts 24 which are formed so as to cover side surfaces of the solder layer 22. The solder layers 22 and the reinforcement resin parts 24 are formed by a resin-containing solder paste. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013048031(A) 申请公布日期 2013.03.07
申请号 JP20110185560 申请日期 2011.08.29
申请人 SHINKO ELECTRIC IND CO LTD 发明人 IHARA YOSHIHIRO
分类号 H01R12/55;H01L23/32;H01R33/76;H01R43/02;H05K3/28;H05K3/34 主分类号 H01R12/55
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