发明名称 |
SUBSTRATE WITH SPRING TERMINAL AND MANUFACTURING METHOD OF THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To reinforce a solder connection part of a spring terminal in a substrate with the spring terminal. <P>SOLUTION: A substrate with a spring terminal includes: a substrate 10 including connection pads P; spring terminals 30, each of which has a connection part 32 connected with the connection pad P by a solder layer 22; and reinforcement resin parts 24 which are formed so as to cover side surfaces of the solder layer 22. The solder layers 22 and the reinforcement resin parts 24 are formed by a resin-containing solder paste. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013048031(A) |
申请公布日期 |
2013.03.07 |
申请号 |
JP20110185560 |
申请日期 |
2011.08.29 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
IHARA YOSHIHIRO |
分类号 |
H01R12/55;H01L23/32;H01R33/76;H01R43/02;H05K3/28;H05K3/34 |
主分类号 |
H01R12/55 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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