发明名称 |
SUBSTRATE WITH BUILT-IN COMPONENT |
摘要 |
A substrate with a built-in component is constructed such that a resin reliably goes around a clearance provided in a lower portion of the component and is thus filled in without expansion of a clearance in a height direction when various components such as an LW reversal type chip component are to be built in. The substrate includes a component to be embedded in a resin layer, and a land electrode (a component mounting electrode) to which external electrodes of the component are to be bonded, the land electrode being provided with a concave groove extending in a transverse direction through which an uncured resin of the resin layer flows, and the uncured resin of the resin layer flows through the concave groove and sufficiently goes around a lower side of the component so that the resin is well filled in when the component in a mounting state is to be embedded in the resin layer.
|
申请公布号 |
US2013058055(A1) |
申请公布日期 |
2013.03.07 |
申请号 |
US201213665977 |
申请日期 |
2012.11.01 |
申请人 |
MURATA MANUFACTURING CO., LTD.;MURATA MANUFACTURING CO., LTD. |
发明人 |
YAMAMOTO YUKI |
分类号 |
H05K1/00;H05K1/09;H05K7/00 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|