| 摘要 |
This electronic component is provided with an inorganic substrate, a conductor film formed on a surface of the substrate, and bonding wires bonded to a part of said conductor film, and wire bonding sections are formed on at least a part of the electronic component. The part of the conductor film at least forming the aforementioned wire bonding sections contains an Ag-based metal formed of Ag or an alloy having Ag as the main constituent and a metal oxide which coats said Ag-based metal and which has, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating quantity of the metal oxide is a quantity corresponding to 0.02 to 0.1 parts by mass relative to 100 parts by mass of the aforementioned Ag-based metal.
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