发明名称 Method and A System for Producing a Semi-Conductor Module
摘要 In a method for producing a semi-conductor module (10) comprising at least two semi-conductor chips (12, 14) and an interposer (20) which has electrically conductive structures (28) connecting the semi-conductor chips (12, 14) to one another, the interposer (20) is printed directly onto a first (12) of the semi-conductor chips. When the interposer (20) is printed on, the electrically conductive structures (28) are produced by means of electrically conductive ink (68). The second semi-conductor chip (14) is mounted on the interposer (20) such that the two semi-conductor chips (12, 14) are arranged one above the other and that the interposer (20) forms an intermediate layer between the two semi-conductor chips (12, 14).
申请公布号 US2013059402(A1) 申请公布日期 2013.03.07
申请号 US201113580455 申请日期 2011.02.22
申请人 JAKOB ANDREAS;KAISER THOMAS 发明人 JAKOB ANDREAS;KAISER THOMAS
分类号 H01L21/66 主分类号 H01L21/66
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