| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic component capable of suppressing mismatching of impedance for transmitting high frequency signal in a good manner. <P>SOLUTION: The package includes a base body 1 containing a first through hole, a placement base stage 6 placed on the upper surface of the base body 1, a circuit board 5 which is placed and jointed on the upper surface of the placement base stage 6, with a signal line conductor 5b formed on its upper surface, and a signal terminal 4 which penetrates a sealing material 3 filled in the first through hole 1a for fixing. The placement base stage 6 contains a second through hole 6a being continued from the first through hole, and one end of the signal terminal 4 protrudes from the upper surface of the placement base stage 6 through the second through hole 6a, and is electrically connected to the signal line conductor 5b. Since the signal terminal 4 penetrates the second through hole 6a, portion of the second through hole 6a forms a so-called air coaxial structure, which allows transmission of high frequency signal in a good manner. <P>COPYRIGHT: (C)2013,JPO&INPIT |
