METHOD FOR MANUFACTURING A FLEXIBLE SUBSTRATE HAVING METAL WIRING EMBEDDED THEREIN, AND FLEXIBLE SUBSTRATE MANUFACTURED BY THE METHOD

摘要

The present invention relates to a method for manufacturing a flexible substrate having metal wiring embedded therein and to a flexible substrate manufactured by the method. More particularly, the present invention relates to a method for manufacturing a flexible substrate having metal wiring embedded therein, wherein the method comprises: a step (step 1) of coating a substrate with a sacrificial layer made of polymers which are soluble in water or in an organic solvent, or of photodegradable polymers; a step (step 2) of forming metal wiring on the sacrificial layer formed in step 1; a step (step 3) of coating the sacrificial layer, on which the metal wiring is formed in step 2, with curable polymers, and hardening the resultant structure so as to obtain a polymer layer having the metal wiring embedded therein; and a step (step 4) of removing only the sacrificial layer existing between the substrate of step 1 and the polymer layer of step 3 by dissolving the sacrificial layer in water or in an organic solvent, or photodecomposing the sacrificial layer, thereby separating the substrate of step 1 and the polymer layer of step 3 from each other.