发明名称 |
THIN-FILM-FORMATION-SUBSTRATE MANUFACTURING METHOD AND THIN-FILM SUBSTRATE |
摘要 |
<p>This method for manufacturing a thin-film-formation substrate includes a substrate preparation step in which a substrate (10) is prepared, a thin-film formation step in which a silicon thin film (13) is formed on top of the substrate (10), and a crystallization step in which the thin film is exposed to a continuous-wave light beam of a prescribed wavelength with the light beam and/or substrate moved so as to implement relative scanning at a prescribed speed, thereby crystallizing at least a prescribed region of the thin film and forming a crystallized region (50). The shape that the light beam forms on the thin film in the crystallization step has a long axis that intersects the direction of the aforementioned relative scanning. The crystallization region is formed so as to contain a band-shaped first region (51), which extends in a direction that intersects the direction of the relative scanning, and a second region (52) adjacent to the band-shaped first region, with the band-shaped first region having a larger mean grain diameter than the second region.</p> |
申请公布号 |
WO2013030885(A1) |
申请公布日期 |
2013.03.07 |
申请号 |
WO2011JP04841 |
申请日期 |
2011.08.30 |
申请人 |
PANASONIC CORPORATION;ODA, TOMOHIKO;KAWASHIMA, TAKAHIRO |
发明人 |
ODA, TOMOHIKO;KAWASHIMA, TAKAHIRO |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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