METHOD OF MANUFACTURING METAL-BASE SUBSTRATE AND METHOD OF MANUFACTURING CIRCUIT BOARD

摘要

A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.