PLATE SHAPED BODY FOR TEMPERATURE MEASUREMENT AND TEMPERATURE MEASURING APPARATUS PROVIDED WITH SAME

摘要

Provided is a plate shaped body for temperature measurement and a temperature measuring device provided with the same that enable the static electric chuck device loading-surface temperature distribution, heating properties, and cooling properties when lowering the temperature, to be easily optimized by simply placing the device on the loading surface of a static electric chuck device and without having to use a semiconductor wafer, which will be a product. Such a temperature measurement wafer (plate shaped body for temperature measurement) (1) is configured as follows: an insulating adhesive material (3) is applied to the entire surface (2a) of a wafer (2); heater elements (4) are provided on this insulating adhesive material (3); temperature measurement regions (5) for measuring the temperature of the surface (2a) of the wafer (2) are provided on the surface (3a) of this insulating adhesive material (3) in the areas other than those occupied by the heater elements (4), and these heater elements (4) and temperature measurement regions (5) are covered with an insulating film (6).