| 摘要 |
<p>Provided is a wiring board with a built-in component, which has an electric/electronic component (16) embedded in an insulating substrate (11). A method for manufacturing such wiring board is also provided. Manufacture burden is reduced and reliability is improved by such wiring board and the method. The wiring board is provided with a wiring pattern (12); the electric/electronic component electrically and mechanically connected on the surface of the wiring pattern; and an insulating layer (11A), which has the electric/electronic component embedded therein, is laminated on the surface on the side whereupon the electric/electronic component of the wiring pattern is connected, and has a reinforcing material (11b) in a region other than a region (11o) where the electric/electronic component is embedded. In the manufacturing process, the electric/electronic component is electrically and mechanically connected on a first metal foil (12A) or on a first metal wiring pattern of a first insulating layer having a first metal wiring pattern; a second insulating layer, which includes the reinforcing material and has an opening at a position corresponding to the electric/electronic component, is arranged on the first metal foil or on the first metal wiring pattern; and furthermore, a second metal foil (13A) or a third insulating layer is arranged on the second insulating layer, and the layers and the component are laminated and integrated.</p> |
