LEAD FRAME FOR LED PACKAGE

摘要

PURPOSE: A lead frame for an LED package is provided to minimize an optical loss and the deterioration of a reflector by reducing collision and interference with lateral light of an adjacent LED chip. CONSTITUTION: A lead frame(100) includes a substrate(10), a chip bonding unit(110), and a reflector(120). The chip bonding unit surrounds a mounted LED chip and includes a depression(111) and a protrusion(112). The protrusion is located between the depression and a lead(113) and is inclined to the bottom of the depression. The reflector is formed on the upper side of the chip bonding unit and reflects light which is directly emitted from the LED chip.