| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser dicing method that controls the occurrence of cracks and implements superior division characteristics by optimizing the irradiation conditions of a pulsed laser beam. <P>SOLUTION: In the laser dicing method, a substrate to be worked is placed on a stage, a clock signal is generated, a pulsed laser beam synchronized with the clock signal is emitted, irradiation and non-irradiation of the pulsed laser beam to the substrate to be worked are switched in light pulse unit by controlling the pulsed laser beam using a pulse picker in synchronization with the clock signal, and a first irradiation of the pulsed laser beam is performed on a first straight line. After the first irradiation, a second irradiation of the pulsed laser beam is performed on a second straight line substantially in parallel with and adjacent to the first straight line, and cracks that reach the substrate surface are formed in the substrate to be worked by the first irradiation and the second irradiation. <P>COPYRIGHT: (C)2013,JPO&INPIT |
