CURABLE RESIN COMPOSITION

摘要

Provided is a curable resin composition exhibiting high adhesion durability. The curable resin composition contains: a (meth)acrylate oligomer (A) selected from the group consisting of urethane-based (meth)acrylate oligomers, polyester-based (meth)acrylate oligomers, polyether-based (meth)acrylate oligomers, epoxy-based (meth)acrylate oligomers, diene polymer-based (meth)acrylate oligomers, and oligomers having a backbone of the hydrogenated product of a diene polymer-based (meth)acrylate; a (meth)acrylate (B) exhibiting a homopolymer glass transition temperature of -100°C to 60°C; one or more compounds (C) having one mercapto group per molecule, the compound(s) being selected from the group consisting of alkanethiols and carboxythiols; and a photopolymerization initiator (D).