发明名称 INSULATING REFLECTIVE SUBSTRATE AND LED PACKAGE
摘要 <p>The purpose of the present invention is to provide an LED package exhibiting excellent insulating properties and diffuse reflectance, and an insulating reflective substrate used therein. The insulating reflective substrate according to the present invention has a metal substrate having an insulating layer on the surface thereof, a metal wiring layer provided on the insulating layer, and a porous layer provided on part of the insulating layer and on part of the metal wiring layer. The metal substrate is a valve metal substrate, the insulating layer is an anodic oxide film of the valve metal, the porosity of the porous layer is 10% or higher, the porous layer contains inorganic particles with an average particle size of 0.1 µm or higher and an inorganic binder, and the inorganic binder is at least one type selected from the group consisting of aluminum phosphate, sodium silicate, and aluminum chloride.</p>
申请公布号 WO2013031987(A1) 申请公布日期 2013.03.07
申请号 WO2012JP72252 申请日期 2012.08.31
申请人 FUJIFILM CORPORATION;HOTTA YOSHINORI 发明人 HOTTA YOSHINORI
分类号 H05K3/28;H01L33/48;H05K1/05 主分类号 H05K3/28
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